Patent Assignment
Reel/Frame 052528/0503
Assignment of Assignor's Interest
Recorded: 2020-04-29
Pages: 3
Assignor
MAINZ, HANS-WILLI
Executed: 2016-06-30
Assignee
SIG TECHNOLOGY AG
LAUFENGASSE 18, NEUHAUSEN AM RHEINFALL, 8212, SWITZERLAND
Covered Property
(1)
Method for Treating the Open Cut Edges of Packaging Material for the Production of Cardboard/Plastics Composite Packaging and a Packaging Material, a Composite Packaging Produced Therefrom and a Container for Receiving Packaging Material
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.