Patent Assignment
Reel/Frame 052535/0648
Assignment of Assignor's Interest
Recorded: 2020-04-30
Pages: 4
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property
(1)
Resin Compositions for Underfill Film for Three Dimensional Through Silica via (Tsv) Packages and Compositions Useful for the Preparation Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.