Patent Assignment
Reel/Frame 052563/0038
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2020-05-04
Received: 2020-05-04
Pages: 5
Assignors
NG, VEMMOND JENG HUNG
Executed: 2020-04-28
YANG, QING
Executed: 2020-04-28
YAO, YUSHUANG
Executed: 2020-04-28
CHEW, CHEE HIONG
Executed: 2020-05-01
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, AZ, 85008, UNITED STATES
Covered Application
(1)
POWER MODULE PACKAGE CASING WITH PROTRUSION SUPPORTS
App. No. 16/865,962
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