Patent Assignment
Reel/Frame 052594/0124
Assignment of Assignor's Interest
Recorded: 2020-05-07
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3DIC Structure and Method of Fabricating the Same