Patent Assignment
Reel/Frame 052619/0584
Assignment of Assignor's Interest
Recorded: 2020-05-11
Pages: 6
Assignors
HOU, HAO-CHENG
Executed: 2020-04-17
LEE, CHIEN-HSUN
Executed: 2020-04-28
LIU, CHUNG-SHI
Executed: 2020-04-28
CHENG, JUNG-WEI
Executed: 2020-04-17
WANG, TSUNG-DING
Executed: 2020-04-17
LEI, YI-YANG
Executed: 2020-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Including Dies Having High-Modulus Dielectric Layer and Manufacturing Method Thereof