Patent Assignment
Reel/Frame 052634/0219
Assignment of Assignor's Interest
Recorded: 2020-05-12
Pages: 8
Assignors
LEE, SOYOUNG
Executed: 2020-04-13
NIHEI, HIROSHI
Executed: 2020-03-06
SHIRAI, MASASHI
Executed: 2020-03-06
LIM, JAESOON
Executed: 2020-03-09
CHO, YOUNJOUNG
Executed: 2020-03-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Selectively Forming Cobalt Metal Layer by Using Cobalt Compound, and Method of Fabricating Semiconductor Device by Using Cobalt Compound
Application:
16/872,504 →
Publication:
US 2021/0032279