Patent Assignment
Reel/Frame 052649/0891
Assignment of Assignor's Interest
Recorded: 2020-05-13
Pages: 6
Assignors
AHN, SANGHOON
Executed: 2020-05-06
LEE, WOOJIN
Executed: 2020-05-06
HAN, KYUHEE
Executed: 2020-05-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Including Air Gaps and Method of Manufacturing the Same