IP Library › Assignment 052682/0432
Patent Assignment
Reel/Frame 052682/0432

Assignment of Assignor's Interest

Recorded: 2020-05-18 Pages: 6
Assignors
CHOI, JAE SIK
Executed: 2018-05-23
JEONG, JIN WON
Executed: 2018-05-23
SEONG, YOUNG SUG
Executed: 2018-05-17
LEE, DONG KEUN
Executed: 2018-05-23
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Property (1)
Test Socket of Flexible Semiconductor Chip Package and Bending Test Method Using the Same
Application: 15/992,543 →
Publication: US 2019/0079114
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →