Patent Assignment
Reel/Frame 052750/0025
Assignment of Assignor's Interest
Recorded: 2020-05-26
Pages: 5
Assignors
CHEN, WEI-YU
Executed: 2020-05-06
CHUANG, CHUN-CHIH
Executed: 2020-05-11
HO, KUAN-LIN
Executed: 2020-05-06
LIANG, YU-MIN
Executed: 2020-05-06
WU, JIUN YI
Executed: 2020-05-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Method of Manufacture