Patent Assignment
Reel/Frame 052768/0574
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 4
Assignors
HSU, CHENG-TUNG
Executed: 2020-05-05
HUNG, CHANG-CHENG
Executed: 2020-05-05
KUO, TYRONE
Executed: 2020-05-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package, Display Apparatus and Manufacturing Method of Semiconductor Package