Patent Assignment
Reel/Frame 052771/0864
Assignment of Assignor's Interest
Recorded: 2020-05-28
Pages: 3
Assignor
YAMAZAKI, SATOSHI
Executed: 2020-03-18
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Three-Dimensional Shaped Object Manufacturing Method and Three-Dimensional Shaping Device