Patent Assignment
Reel/Frame 053000/0362
Assignment of Assignor's Interest
Recorded: 2020-06-22
Pages: 4
Assignors
WANG, YU SHIH
Executed: 2020-06-05
YANG, HONG-JIE
Executed: 2020-06-05
LEE, CHIA-YING
Executed: 2020-06-05
YEH, PO-NAN
Executed: 2020-06-05
CHIU, U-TING
Executed: 2020-06-05
LIN, CHUN-NENG
Executed: 2020-06-05
YEH, MING-HSI
Executed: 2020-06-05
HUANG, KUO-BIN
Executed: 2020-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Breaking Through Etch Stop Layer