Patent Assignment
Reel/Frame 053091/0245
Assignment of Assignor's Interest
Recorded: 2020-06-30
Pages: 6
Assignors
KANG, MYUNGSAM
Executed: 2020-04-29
PARK, YONGJIN
Executed: 2020-04-29
KO, YOUNGCHAN
Executed: 2020-04-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
System in Package (Sip) Semiconductor Package