Patent Assignment
Reel/Frame 053105/0757
Assignment of Assignor's Interest
Recorded: 2020-07-02
Pages: 2
Assignor
OHTSUKA, KENICHI
Executed: 2020-05-19
Assignee
HAMAMATSU PHOTONICS K.K.
1126-1, ICHINO-CHO, HIGASHI-KU, HAMAMATSU-SHI, SHIZUOKA, 435-8558, JAPAN
Covered Property
(1)
Film Thickness Measurement Device, Film Thickness Measurement Method, Film Thickness Measurement Program, and Recording Medium for Recording Film Thickness Measurement Program