Patent Assignment
Reel/Frame 053170/0227
Assignment of Assignor's Interest
Recorded: 2020-07-10
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2020-06-16
YU, CHUN-HUI
Executed: 2020-06-16
HUNG, JENG-NAN
Executed: 2020-06-16
YEE, KUO-CHUNG
Executed: 2020-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof