IP Library Assignment 053176/0265
Patent Assignment
Reel/Frame 053176/0265

Assignment of Assignor's Interest

Recorded: 2020-07-10 Pages: 2
Assignor
ELLIOT, BRENT
Executed: 2020-01-08
Assignee
COMPONENT RE-ENGINEERING COMPANY, INC.
3508 BASSETT STREET, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
Application: 16/817,627 →
Publication: US 2020/0357676
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2020
From: BALMA, FRANK
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 053176/0380 →
Assignment of Assignor's Interest Jul 10, 2020
From: HUSSEN, GULEID
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 053176/0559 →
Assignment of Assignor's Interest Jul 10, 2020
From: STEPHENS, JASON
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 053176/0698 →
Assignment of Assignor's Interest Jul 10, 2020
From: PARKER, MICHAEL
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 053176/0817 →
Assignment of Assignor's Interest Sep 16, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 053786/0986 →
Patent Security Agreement (Short Form) Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →