Patent Assignment
Reel/Frame 053196/0550
Assignment of Assignor's Interest
Recorded: 2020-07-14
Pages: 4
Assignors
KUO, HUNG-JUI
Executed: 2020-06-24
TSAI, HUI-JUNG
Executed: 2020-06-24
PENG, JYUN-SIANG
Executed: 2020-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same