Patent Assignment
Reel/Frame 053202/0550
Assignment of Assignor's Interest
Recorded: 2020-07-14
Pages: 10
Assignee
GAN SYSTEMS INC.
1145 INNOVATION DR., OTTAWA, K2K 3G8, CANADA
Covered Property
(1)
Embedded Die Packaging for Power Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.