Patent Assignment
Reel/Frame 053251/0121
Assignment of Assignor's Interest
Recorded: 2020-07-20
Pages: 6
Assignors
KIM, TAEYEONG
Executed: 2020-05-11
HAN, ILYOUNG
Executed: 2020-07-01
KIM, HOECHUL
Executed: 2020-05-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Bonding Apparatus and Method of Manufacturing Semiconductor Device by Using the Same