Patent Assignment
Reel/Frame 053355/0899
Assignment of Assignor's Interest
Recorded: 2020-07-30
Pages: 6
Assignors
HONG, WONHYUK
Executed: 2020-06-24
LEE, JONGJIN
Executed: 2020-06-24
KIM, RAKHWAN
Executed: 2020-06-24
JUNG, EUN-JI
Executed: 2020-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device having Interconnection Lines with Different Linewidths and Metal Patterns