Patent Assignment
Reel/Frame 053398/0688
Assignment of Assignor's Interest
Recorded: 2020-08-04
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Stack Modules Comprised of Interposing Bridges and Semiconductor Dies
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.