IP Library Assignment 053464/0365
Patent Assignment
Reel/Frame 053464/0365

Assignment of Assignor's Interest

Recorded: 2020-08-11 Pages: 5
Assignors
RABADAM, ELEANOR PATRICIA PARAS
Executed: 2020-08-10
RAMISO, MARIA ANGELA DAMILLE
Executed: 2020-08-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Stepped Electronic Substrate for Integrated Circuit Packages
Application: 16/990,740 →
Publication: US 2022/0051986
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072914/0491 →