Patent Assignment
Reel/Frame 053530/0063
Assignment of Assignor's Interest
Recorded: 2020-08-18
Pages: 7
Assignors
ARENE, EMMANUEL
Executed: 2019-10-15
LETHIECQ, ROBIN
Executed: 2019-10-15
NGUYEN, PAVINA
Executed: 2019-10-15
MACKANIC, CHRISTOPHER
Executed: 2019-10-15
Assignee
PRIMO1D
7 PARVIS LOUIS NEEL, GRENOBLE CEDEX 9, 38040, FRANCE
Covered Property
(1)
Method for Inserting a Wire into a Groove of a Semiconductor Chip