IP Library Assignment 053591/0053
Patent Assignment
Reel/Frame 053591/0053

Assignment of Assignor's Interest

Recorded: 2020-08-25 Pages: 4
Assignors
KIM, SEUNG MIN
Executed: 2020-06-30
AN, JOONG KYU
Executed: 2020-06-28
JIN, SHAN HUA
Executed: 2020-06-24
Assignee
KCF TECHNOLOGIES CO., LTD.
4F., 39, LS-RO 116BEON-GIL, DONGAN-GU, ANYANG-SI, GYEONGGI-DO, 14118, KOREA, REPUBLIC OF
Covered Property (1)
Electrolytic Copper Foil Having High-Temperature Dimensional Stability and Texture Stability, and Manufacturing Method Therefor
Application: 16/959,360 →
Publication: US 2021/0025067
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
[Revised] Change of Name and Corporate Address Nov 24, 2020
From: KCF TECHNOLOGIES CO., LTD.
To: SK NEXILIS CO., LTD.
Reel/Frame 055693/0699 →