Patent Assignment
Reel/Frame 053670/0492
Assignment of Assignor's Interest
Recorded: 2020-09-02
Pages: 3
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Semiconductor Device Including Glass Substrate Having Improved Reliability and Method of Manufacturing the Same