IP Library Assignment 053718/0304
Patent Assignment
Reel/Frame 053718/0304

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2020-09-09 Received: 2020-09-09 Pages: 11
Assignors
ALLEGRO MICROSYSTEMS FRANCE SAS
Executed: 2020-09-04
CAMPIGLIO, PAOLO
Executed: 2020-09-07
CHETLUR, SUNDAR
Executed: 2020-09-07
KLEBANOV, MAXIM
Executed: 2020-09-07
LIU, YEN TING
Executed: 2020-09-07
Assignee
ALLEGRO MICROSYSTEMS, LLC
955 PERIMETER ROAD, MANCHESTER, NH, 03103-3353, UNITED STATES
Covered Application (1)
MULTI-LAYER INTEGRATED CIRCUIT WITH ENHANCED THERMAL DISSIPATION USING BACK-END METAL LAYERS
App. No. 17/014,129