IP Library › Assignment 053734/0396
Patent Assignment
Reel/Frame 053734/0396

Assignment of Assignor's Interest

Recorded: 2020-09-10 Pages: 2
Assignor
TACHIBANA, MINORU
Executed: 2019-10-25
Assignee
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
3-1-1, KYOBASHI, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property (1)
Plate Thickness Control Device and Plate Thickness Control Method
Application: 16/979,668 →
Publication: US 2021/0394245
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →