Patent Assignment
Reel/Frame 054247/0611
Assignment of Assignor's Interest
Recorded: 2020-11-02
Pages: 14
Assignors
QIAN, ZHIGUO
Executed: 2020-06-18
PASDAST, GERALD
Executed: 2020-06-18
ZENG, JUAN
Executed: 2020-06-18
WANG, PEIPEI
Executed: 2020-06-18
SIDDIQUI, AHMAD
Executed: 2020-06-22
SESHAN, LAKSHMIPRIYA
Executed: 2020-06-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Scalable and Interoperable Phyless Die-to-Die Io Solution