Patent Assignment
Reel/Frame 054257/0771
Assignment of Assignor's Interest
Recorded: 2020-11-03
Pages: 6
Assignors
HOU, SHANG-YUN
Executed: 2020-09-21
HU, HSIEN-PIN
Executed: 2020-09-29
CHIU, SAO-LING
Executed: 2020-09-29
WEI, WEN-HSIN
Executed: 2020-08-21
HUANG, PING-KANG
Executed: 2020-10-05
SHEN, CHIH-TA
Executed: 2020-08-21
LU, SZU-WEI
Executed: 2020-10-07
SHIH, YING-CHING
Executed: 2020-10-07
CHIOU, WEN-CHIH
Executed: 2020-10-13
WU, CHI-HSI
Executed: 2020-10-30
YU, CHEN-HUA
Executed: 2020-09-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Giga Interposer Integration through Chip-On-Wafer-On-Substrate