Patent Assignment
Reel/Frame 054324/0220
Assignment of Assignor's Interest
Recorded: 2020-11-10
Pages: 4
Assignor
NISHIDA, YUHEI
Executed: 2020-11-09
Assignee
FUJI ELECTRIC CO., LTD.
1-1 TANABESHINDEN, KAWASAKI-KU, KAWASAKI-SHI, KANAGAWA, 210-9530, JAPAN
Covered Property
(1)
Semiconductor Device, Semiconductor Manufacturing Apparatus and Method of Manufacturing Semiconductor Device Having Printed Circuit Board and Insulating Board with Complementary Warps