Patent Assignment
Reel/Frame 054504/0632
Assignment of Assignor's Interest
Recorded: 2020-12-01
Pages: 4
Assignors
LI, SHU-WEI
Executed: 2020-11-04
CHAN, YU-CHEN
Executed: 2020-11-04
YANG, SHIN-YI
Executed: 2020-11-04
LEE, MING-HAN
Executed: 2020-11-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Two 2D Capping Layers on Interconnect Conductive Structure to Increase Interconnect Structure Reliability