Patent Assignment
Reel/Frame 054655/0947
Assignment of Assignor's Interest
Recorded: 2020-12-15
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Die and Photoelectric Device Integrated in Same Package