Patent Assignment
Reel/Frame 054763/0630
Assignment of Assignor's Interest
Recorded: 2020-12-29
Pages: 4
Assignors
SUO, PENG
Executed: 2020-12-06
WANG, YING W.
Executed: 2020-12-06
SEE, GUAN HUEI
Executed: 2020-12-04
YONG, CHANG BUM
Executed: 2020-12-04
SUNDARRAJAN, ARVIND
Executed: 2020-12-14
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods of Forming Through-Silicon Vias in Substrates for Advanced Packaging