Patent Assignment
Reel/Frame 054782/0980
Assignment of Assignor's Interest
Recorded: 2020-12-31
Pages: 4
Assignors
TSOU, HSIEN-JU
Executed: 2020-12-22
WU, CHIH-WEI
Executed: 2020-12-22
SHIH, YING-CHING
Executed: 2020-12-22
LU, SZU-WEI
Executed: 2020-12-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Silicon Interposer Including Through-Silicon via Structures with Enhanced Overlay Tolerance and Methods of Forming the Same