Patent Assignment
Reel/Frame 054831/0358
Assignment of Assignor's Interest
Recorded: 2021-01-06
Pages: 4
Assignors
FAN, CHIH-HSIANG
Executed: 2020-12-10
SHEN, TSUNG-HAN
Executed: 2020-12-10
LIN, JIA-MING
Executed: 2020-12-10
LEE, WEI-CHIN
Executed: 2020-12-10
LEE, HSIEN-MING
Executed: 2020-12-10
CHUI, CHI ON
Executed: 2020-12-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Void Elimination for Gap-Filling in High-Aspect Ratio Trenches