Patent Assignment
Reel/Frame 054980/0377
PATENT SECURITY AGREEMENT SUPPLEMENT
Recorded: 2021-01-13
Received: 2021-01-13
Pages: 7
Assignor
VERITAS TECHNOLOGIES LLC
Executed: 2020-12-17
Assignee
WILMINGTON TRUST, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
1100 NORTH MARKET STREET, WILMINGTON, DE, 19890, UNITED STATES
Covered Applications
(44)
Performing Backup Operations Using Replicas
App. No. 17/038,921
→
Methods and Systems For Eventually-Complete Backups
App. No. 16/993,717
→
REAL-TIME ASSESSMENT OF MULTIMEDIA SERVICE IN A PARTICULAR ENVIRONMENT
App. No. 15/994,362
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
App. No. 15/479,779
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 15/042,777
→
POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
App. No. 14/875,513
→
GROOVED CMP PADS
App. No. 14/874,179
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/732,497
→
POLISHING PAD WITH GROOVED FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/727,586
→
LOW DENSITY POLISHING PAD
App. No. 14/611,064
→
POLISHING PAD WITH ALIGNMENT FEATURE
App. No. 14/610,991
→
METHOD OF FABRICATING A POLISHING
App. No. 14/550,129
→
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON
App. No. 14/530,534
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 14/489,177
→
POLISHING PAD HAVING POROGENS WITH LIQUID FILLER
App. No. 14/307,846
→
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
App. No. 14/183,894
→
HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
App. No. 14/152,792
→
Polishing Pad for Eddy Current End-Point Detection
App. No. 14/099,655
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS
App. No. 13/829,990
→
POLISHING SYSTEMS
App. No. 13/757,163
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
App. No. 13/747,139
→
METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS
App. No. 13/612,135
→
POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER
App. No. 13/488,149
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 13/306,845
→
POLISHING PAD WITH GROOVED FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 13/306,849
→
POLISHING PAD WITH ALIGNMENT APERTURE
App. No. 13/184,395
→
POLISHING PAD WITH ALIGNMENT FEATURE
App. No. 13/101,826
→
POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
App. No. 13/014,630
→
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
App. No. 12/979,123
→
POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
App. No. 12/895,465
→
METHOD OF FABRICATING A POLISHING PAD WITH AN END-POINT DETECTION REGION FOR EDDY CURRENT END-POINT DETECTION
App. No. 12/895,529
→
HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
App. No. 12/895,479
→
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
App. No. 12/832,908
→
CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION
App. No. 12/767,712
→
CMP pad with local area transparency
App. No. 12/657,135
→
POLISHING SYSTEMS
App. No. 12/456,546
→
Grooved CMP pad
App. No. 12/381,709
→
Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
App. No. 11/884,829
→
Customized polishing pads for CMP and methods of fabrication and use thereof
App. No. 11/998,319
→
METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS
App. No. 11/998,212
→
CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION
App. No. 11/998,196
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 11/251,547
→
METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS
App. No. 10/897,192
→
CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION
App. No. 10/810,070
→