Patent Assignment
Reel/Frame 055023/0312
Assignment of Assignor's Interest
Recorded: 2021-01-25
Pages: 5
Assignors
SU, HUAN-CHIEH
Executed: 2020-12-27
YU, LI-ZHEN
Executed: 2020-12-27
CHEN, CHUN-YUAN
Executed: 2020-12-27
CHUANG, CHENG-CHI
Executed: 2020-12-27
CHANG, SHANG-WEN
Executed: 2020-12-27
CHIU, YI-HSUN
Executed: 2020-12-27
WANG, PEI-YU
Executed: 2021-01-04
TSAI, CHING-WEI
Executed: 2021-01-17
WANG, CHIH-HAO
Executed: 2021-01-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure with Backside via Rail