Patent Assignment
Reel/Frame 055085/0676
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 4
Assignors
LIN, JIAN-HONG
Executed: 2021-01-11
HSIEH, MING-HONG
Executed: 2021-01-11
CHANG, HSIN-CHUN
Executed: 2021-01-11
WANG, MING-YIH
Executed: 2021-01-11
LU, YINLUNG
Executed: 2021-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Through-Circuit Vias in Interconnect Structures