Patent Assignment
Reel/Frame 055151/0807
Assignment of Assignor's Interest
Recorded: 2021-02-04
Pages: 4
Assignors
ECHIGOYA, GAKU
Executed: 2021-01-29
SATOU, HIROSHI
Executed: 2021-01-29
ISHIDA, KEIJIRO
Executed: 2021-01-29
KUDO, HAJIME
Executed: 2021-01-29
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Property
(1)
Multilayer Chip Component