Patent Assignment
Reel/Frame 055187/0546
Assignment of Assignor's Interest
Recorded: 2021-02-08
Pages: 4
Assignors
WANG, TSUNG-DING
Executed: 2020-12-14
SU, YEN-FU
Executed: 2020-12-14
HOU, HAO-CHENG
Executed: 2020-12-15
CHENG, JUNG-WEI
Executed: 2020-12-17
LEE, CHIEN-HSUN
Executed: 2020-12-14
PAN, HSIN-YU
Executed: 2020-12-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Through Vias and Stacked Redistribution Layers and Manufacturing Method Thereof