Patent Assignment
Reel/Frame 055318/0880
Assignment of Assignor's Interest
Recorded: 2021-02-18
Pages: 3
Assignors
VAN DAL, MARCUS JOHANNES HENRICUS
Executed: 2021-02-08
DOORNBOS, GERBEN
Executed: 2021-02-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Chip Having a Buried Power Rail