IP Library Assignment 055376/0924
Patent Assignment
Reel/Frame 055376/0924

Assignment of Assignor's Interest

Recorded: 2021-02-23 Pages: 3
Assignor
POLLARD, THOMAS BAIN
Executed: 2019-05-15
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Multiple Layer System, Method of Manufacture and Saw Device Formed on the Multiple Layer System
Application: 16/977,753 →
Publication: US 2021/0013862
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 23, 2021
From: KIHARA, YOSHIKAZU; METZGER, THOMAS
To: QUALCOMM GERMANY RFFE GMBH
Reel/Frame 055376/0874 →
Assignment of Assignor's Interest Feb 23, 2021
From: QUALCOMM GERMANY RFFE GMBH
To: RF360 EUROPE GMBH
Reel/Frame 055377/0024 →
Assignment of Assignor's Interest Feb 23, 2021
From: QUALCOMM INCORPORATED
To: RF360 EUROPE GMBH
Reel/Frame 055377/0100 →
Assignment of Assignor's Interest Mar 16, 2023
From: RF360 EUROPE GMBH
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 063272/0475 →
Change of Owner's Address Nov 22, 2024
From: RF360 SINGAPORE PTE. LTD.
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 069761/0931 →