Patent Assignment
Reel/Frame 055386/0983
Assignment of Assignor's Interest
Recorded: 2021-02-24
Pages: 6
Assignors
KANG, MYUNGSAM
Executed: 2021-01-26
KO, YOUNGCHAN
Executed: 2021-01-26
JEONG, TAESUNG
Executed: 2021-01-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same