Patent Assignment
Reel/Frame 055430/0343
Assignment of Assignor's Interest
Recorded: 2021-02-26
Pages: 3
Assignors
TSAI, CHEN-YU
Executed: 2021-02-22
YANG, KU-FENG
Executed: 2021-02-23
CHIOU, WEN-CHIH
Executed: 2021-02-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding Structures of Integrated Circuit Devices and Method Forming the Same