Patent Assignment
Reel/Frame 055442/0978
Assignment of Assignor's Interest
Recorded: 2021-03-01
Pages: 4
Assignor
ISHII, RYUICHI
Executed: 2021-01-26
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device Resistant to Thermal Cracking and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.