Patent Assignment
Reel/Frame 055546/0309
Assignment of Assignor's Interest
Recorded: 2021-03-10
Pages: 3
Assignor
SOUMIYA, AKIKO
Executed: 2021-02-03
Assignee
FUJIMI INCORPORATED
1-1, CHIRYO 2-CHOME,, NISHIBIWAJIMA-CHO, KIYOSU-SHI, AICHI, 4528502, JAPAN
Covered Property
(1)
Polishing Composition, Production Method of the Same, Polishing Method and a Manufacturing Method of a Semiconductor Substrate