Patent Assignment
Reel/Frame 055631/0137
Assignment of Assignor's Interest
Recorded: 2021-03-18
Pages: 8
Assignors
VERMA, PURAKH RAJ
Executed: 2021-03-10
XING, SU
Executed: 2021-03-10
PARTHASARATHY, SHYAM
Executed: 2021-03-10
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Bonded Semiconductor Structure and Method for Forming the Same