Patent Assignment
Reel/Frame 055663/0974
Assignment of Assignor's Interest
Recorded: 2021-03-22
Pages: 3
Assignors
HIDESHIMA, YASUTOSHI
Executed: 2021-01-15
NAKAMURA, HIDEFUMI
Executed: 2021-01-25
KATO, MAKOTO
Executed: 2021-01-15
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Method for Manufacturing Thixomolding Material
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.