IP Library › Assignment 055671/0500
Patent Assignment
Reel/Frame 055671/0500

Assignment of Assignor's Interest

Recorded: 2021-03-22 Pages: 10
Assignors
HANNAN, JIM
Executed: 2021-03-12
MCDONALD, ANDREW
Executed: 2021-03-10
Assignee
TPI COMPOSITES, INC.
373 MARKET STREET, WARREN, RHODE ISLAND, 02885
Covered Properties (2)
Mold with Thermally Conductive Flanges
Application: 16/058,605 →
Publication: US 2019/0291305
Mold with Thermally Conductive Flanges
Application: 62/646,185 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Confirmatory Grant of Security Interest in United States Patents Apr 6, 2018
From: TPI COMPOSITES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 045853/0078 →
Release of Security Interest Nov 24, 2021
From: JPMORGAN CHASE BANK, N.A.
To: TPI COMPOSITES, INC.
Reel/Frame 058207/0253 →
Security Interest Dec 14, 2023
From: TPI COMPOSITES, INC.
To: OAKTREE FUND ADMINISTRATION, LLC
Reel/Frame 066014/0207 →