Patent Assignment
Reel/Frame 055695/0558
Assignment of Assignor's Interest
Recorded: 2021-03-24
Pages: 4
Assignee
DOWA ELECTRONICS MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
Covered Property
(1)
Silver Powder, Production Method Thereof, and Conductive Paste